Used SPEEDFAM SNQ-32BTAW #9203852 for sale

SPEEDFAM SNQ-32BTAW is a versatile and reliable wafer grinding, lapping and polishing equipment designed for the precise handling of a variety of materials, from 200mm to 300mm wafers. This system offers an excellent tool for creating a consistent and uniform surface finish on multiple wafers, regardless of the material type. This eliminates the need for multiple passes to create the desired level of finish and guarantees a superior end product. The robust design of SNQ-32BTAW is capable of processing wafers in both single- and multi-wafer configuration at up to 32 wafers per cycle, while still providing extreme accuracy of less than 1% non-repeating error. It also provides automatic adjustment of process repeatability and a wide range of operating speeds, allowing for the optimum performance of the grinding, lapping and polishing process. SPEEDFAM SNQ-32BTAW features a high power ultrasonic spindle that provides extremely quiet operation and reliable performance at high speed operation, resulting in superior wafer surface uniformity. A four-stage filter unit prevents process contaminants from entering the machine, and a fully-sealed machine design eliminates the possibility of airborne contamination. In addition, SNQ-32BTAW comes with a number of standard features to ensure maximum effectiveness and efficiency of the process including a high-precision, multi-position spindle table for precise grinding, lapping and polishing of wafers. In addition, an integrated vision machine allows for quick and easy recipe development, and an intuitive touchscreen interface simplifies the operator's workflow. The operation and maintenance of SPEEDFAM SNQ-32BTAW is simple and straight forward with minimal training required. It includes a modular design that allows for simple and convenient maintenance, and an easy to read report generation module to quickly review the performance of the tool. In summary, SNQ-32BTAW is a reliable and efficient wafer grinding, lapping and polishing asset that provides superb performance across a wide range of materials, from 200mm to 300mm wafers. It offers great accuracy, repeatability and overall efficiency, as well as automated and intuitive operation, making it an ideal choice for research and development applications.