Used SPEEDFAM SP 1200 #9191609 for sale

SPEEDFAM SP 1200 is a wafer grinding, lapping and polishing equipment designed specifically for the semiconductor and electronics industry. This system is built for precision, accuracy, repeatability and ease of use, while also being extremely reliable. SPEEDFAM SP-1200 is equipped with a range of features that allow for effective and efficient wafer processing. SP 1200 is built with a range of motors and pulleys that can be used to adjust the spindle speed of the unit, allowing for speeds of up to 120 revolutions per minute. This provides great flexibility for the user, allowing for grinding, lapping and polishing operations to be undertaken with precision and accuracy. The machine is also equipped with a two-stage filtration tool, which allows for the capture of particulate contamination. This ensures that the wafers are free of contamination before, during, and after the lapping operation. SP-1200 is also equipped with a wafer support asset which is configured to accommodate substrates in a range of sizes. This supports the lapping operation with minimal deviation from the desired finish. The model is also equipped with several position encoders and parameters, allowing for automated operations and manual operations with precise control over the various parameters. SPEEDFAM SP 1200 equipment is also equipped with a range of safety features designed to protect the operator and the system from potential hazards associated with the use of the unit. This includes safety interlocks that prevent the machine from running if the safety gate is not closed, as well as an emergency stop button for emergencies. Overall, SPEEDFAM SP-1200 tool is designed to ensure that wafer grinding, lapping and polishing operations are done with precision and accuracy and that the associated safety requirements are met. This asset is used by a range of semiconductor manufacturers to ensure that the produced wafers are of the highest quality.