Used SPEEDFAM SP 1200 #9259369 for sale

SPEEDFAM SP 1200 is an automated wafer grinding, lapping and polishing equipment. This versatile unit is built for precise and repeatable wafer processing. In addition to grinding and polishing substrates, the machine can be used for fine wafer lapping with the option of rotating lapping plates for both front and backside of wafers. The system is designed to process the largest wafers (up to 500mm) allowing for high throughput and flexibility. SPEEDFAM SP-1200 has a working chamber with dimensions of 600x750x525mm (l x w x h). Internal height can be customized from 380 to 475mm for both wafer thickness and wafer lapping. The internal pressure of the working chamber is maintained by a two-stage dust extractor that ensures that the wafers are kept free of contamination during the entire process. The automated process is powered by a robotic arm equipped with an end-effector unit, which operates a grinding, lapping and polishing (GLP) module that includes a vacuum chuck, diamond slurry cup and a rotary plate. The rotary plate turns at a range of 300-1500 rpm enabling exact control of the speed of the grinding or polishing process. The GLP module is also outfitted with a diagnostic machine that monitors parameters such as air supply, pump pressure, grinding force and speed, relative humidity in the chamber, and substrate size and pressure. This ensures that the tool is operating at optimal levels. The unit includes a loading and unloading function for easy wafer handling, and has the ability to store up to 50 wafer programs. It is also equipped with an intuitive user interface that allows for easy monitoring and control of the asset during operation. SP 1200 is designed to ensure reliable and consistent wafer processing. Its robust and reliable model provides a number of advantages over manual processes, including faster completion times, precise and repeatable results, minimal contamination risk, and improved process control and performance.