Used SPEEDFAM SP 800 #143296 for sale

SPEEDFAM SP 800 is a wafer grinding, lapping and polishing equipment designed for repeatable, high precision processing of advanced semiconductor wafers. It consists of a tabletop-mounted spindle workhead with integrated air bearing support, adjustable and configurable polishing stage, and fully automated traceability. The system utilizes a high-torque, low-speed spindle with air bearings for confident handling and precise positioning of the wafer, as well as an adjustable and configurable polishing stage for effective polishing operations. A key feature of the unit is its ability to precisely control the grinding and polishing process by monitoring the load and keeping the process stable and consistent. A fully automated traceability machine provides accurate records of the polishing process, including the grinding and polishing parameters, error-recovery history, and historical trends. This helps minimize defect-induced scrap and rework. It also offers an intuitive graphical HMI with integrated process control parameters and alarm management. A wide variety of accessories are also available, which allow users to customize the tool and configure it for different polishing applications. Overall, SP 800 is an ideal choice for repeatable, high precision processing of advanced semiconductor wafer materials.