Used SPEEDFAM SP 800 #9143432 for sale

SPEEDFAM SP 800
ID: 9143432
Vintage: 1996
Polisher 1996 vintage.
SPEEDFAM SP 800 is a highly sophisticated wafer grinding, lapping and polishing equipment ideal for the production of advanced scale electronic devices. This system boasts a wide range of features and functions, allowing it to achieve extremely precise and consistent results over a variety of materials and structures. SP 800 gets its name from its speed and precision, allowing manufacturers to quickly and accurately remove material or create a intricate structure over a range of materials, from hard silica and ceramics to softer organics and metals. It uses rotary diamond cutting wheels to remove large chunks of material and then smooth, grind, lap and polish the surface. This unit is versatile and can be tailored to specific production requirements. SPEEDFAM SP 800 is compatible with a range of features and technologies that enable it to achieve complex structures and precise results in a fraction of the time it would take with conventional methods. Its patented Edge Profiling Machine (EPS) technology is capable of quickly and accurately grinding, lapping and polishing bevels, primary and secondary corners and flat surfaces without the need for manual intervention. SPEEDFAM patented Hybrid Precision Grinding (HPG) technology enables the tool to combine rotary grinding and lapping wheels with grinding media and abrasive discs for a finer surface finish. This significantly improves processing precision and reduces physical labor and resharpening costs, extending the life of the wheels. The HPG technology also provides improved surface flatness and faster processing times. SP 800 is equipped with measurement, control and automated loading solutions, and offers a wide range of operation modes. This provides manufacturers with maximum flexibility in production and allows them to adjust settings according to specific requirements such as material type, size and process conditions. Overall, SPEEDFAM SP 800 is a comprehensive wafer grinding, lapping and polishing asset designed to give manufacturers maximum control over precision, speed and accuracy of their production processes. Its unique features and technologies enable it to quickly and accurately process a variety of materials, structures, and surfaces for reliable and consistent results.
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