Used SPEEDLAP 18 #293608896 for sale

SPEEDLAP 18 is a wafer grinding, lapping, and polishing equipment designed for unmatched performance, robustness and reliability. This automated grinding and polishing system is designed for easy and cost effective wafer manufacturing. The unit uses patented technology to precisely grind, lap, and polish. The revolutionary unit has a capacity of up to 18 wafers, allowing for an increased efficiency in manufacturing processes. It features a unique modular design that allows for a rapid set-up and process changeover. The machine also utilizes a highly integrated tool of spindle motors, which enable an effective grinding performance of up to 1000in/min. The control asset consists of a P-controller with integrated camera model and a CNC of choice. The P-controller is equipped with unique live 3D view and a smart processor which provides auto detection of the wafer shapes. This makes SPEEDLAP 18 widely compatible with a variety of wafers. The innovative lap grinding motor is designed for a high lap rate. The motor is composed of a dual drive equipment, with an integrated cooling system that is designed for wafer processing without changing settings. Additionally, the unit utilizes a number of sensors to provide accurate, real-time feedback on grind/polish settings. 18 is also an energy efficient machine with high flexibility to be tailored to meet high quality standards. The tool is servomotor driven with an energy-saving feature to make it more efficient for high value applications. SPEEDLAP 18 asset also comes with a variety of options to customize the wafer processing depending on the application. The model can be configured with additional wafer fixtures to increase its capacity and its efficiency. Furthermore, the equipment can be integrated with other machines such as spinners and hand-guided polishers. For added safety and reliability, the system is equipped with a high-performance dust removal unit and a powerful vacuum machine that make it immune from contamination from the environment. The tool is perfect for working with a variety of metals and materials, making it highly versatile for many applications. Overall, 18 asset is designed for a streamlined automation process, enabling wafer grinding, lapping, and polishing with its comprehensive capabilities. Its optimized design and reliable performance make it a highly dependable model for wafer manufacturing.