Used SPITFIRE 48" Continuous Polisher #9134848 for sale

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ID: 9134848
Open face lapping machine 48” O.D., 13” I.D. Steel table top 10 hp motor 3 phase 220V Variable Frequency Drive to control table speed Hoist and table conditioner Currently not operational.
The Spitzfire SPITFIRE 48" Continuous Polisher is a highly efficient and powerful wafer grinding, lapping and polishing equipment that has been designed for the modern semiconductor industry. It is capable of producing extremely flat, smooth and precise surfaces quickly and accurately. The system incorporates leading-edge automation features including a four-axis robotic tool loader, automatic wafer handling, and on-board vision inspection unit. The Spitzfire 48" Continuous Polisher was designed to handle large and irregular substrates with ease. It features a three-stage grinding process; lapping and polishing which enables the highest degree of accuracy and repeatability. The machine also includes face-to-face grinding of up to five wafers in a single operation; a unique feature among wet grinding systems. The polisher is equipped with a powerful 80 HP motor and advanced controls that ensure precise and consistent wafer polishing. It is further equipped with an automated water delivery tool to optimize the lubricating effect of the abrasive media and to provide consistent and repeatable operation. It also features a special air jet asset to cool the wafer as it is being polished. The model is also very easy to use and maintain with its intuitive user interface. It offers a range of advanced graphical visualizations that help identify problem areas and guide the operator to the best solution. The machine can be quickly and easily setup and configured for any specific application. The Spitzfire SPITFIRE 48" Continuous Polisher is a highly advanced and efficient wafer polishing equipment that offers unparalleled performance. With its advanced automation and user-friendly operation, the system is ideal for a variety of applications in the semiconductor industry. It is designed to deliver superior wafer polishing results in a fraction of the time of other systems.
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