Used SPITFIRE SP-888-36-DW #134555 for sale

SPITFIRE SP-888-36-DW is an automated wafer grinding, lapping and polishing equipment designed to fulfill the most exacting requirements of the semiconductor industry. It provides fast, precise and repeatable results while producing slurry with minimal particle generation. The system consists of a robotic arm mounted on a motorized platform, a tray mounted spindle, three 8-inch flap wheels, a 2-stage polishing head and a dust-free chamber for lapping and polishing. The robotic arm can position each of the 8-inch flap wheels and the two stage polishing head, allowing for the quick and accurate processing of wafers in both lapping and polishing modes. SP-888-36-DW is equipped with a precision-engineered dual-axial spindle unit that has a maximum speed of 36 000 rpm. The motorized platform provides smoother operation, increased motor torque and improved accuracy when positioning the spindle and robot arm. The Dual-axial spindle machine also features a unique feedback loop that monitors the polishing force in real-time and provides an accurate estimate of the processing forces. This ensures consistency during each grinding, lapping and polishing cycle. The 8-inch flap wheels minimize particle generation, provide uniform polishing and lapping results, and are interchangeable with optional diamond-coated grinding wheels. The two stage polishing head facilitates the fast and even removal of large amounts of material. A unique feature of SPITFIRE SP-888-36-DW is the dust-free chamber which isolates the grinding, lapping and polishing process from the environment. This enables the user to achieve clean and repeatable results. Offering high-precision, versatility, robustness and automation, SP-888-36-DW is an ideal solution for manufacturers of complex and high-performance semiconductor materials, such as MEMS, ASICs, and Imagers. Its optimized design reduces grinding and polishing times, increases production quality, reduces waste and enhances profitability.