Used SPITFIRE SP-F888-72 #9395769 for sale

SPITFIRE SP-F888-72 is a state-of-the-art wafer grinding, lapping, and polishing equipment. It is used to accurately and precisely shape wafers thin enough for further processing. Wafers are precision-ground, lapped, and polished for yield enhancement or enhanced planarity, die strength, and surface finish. The system also automates the entire process, allowing for more consistent production and improved process control. SP-F888-72 utilizes a three-stage configuration for grinding, lapping, and polishing with two independent processes. The first stage involves pre-grinding, which removes surface irregularities from the wafers. This takes place with the plane grinding mode, which utilizes a single or double-sided process, and is managed by a menu-driven computer control unit. The second stage involves lapping process to remove surface roughness while keeping the substrate intact. This process is managed by a Spherical Motion Lapping Sinusoid Drive (SMLSD) machine, and serves to improve mechanical planarity and yield the desired thickness of the wafer. The last stage of all is the polishing process. Although it is not required for every application, it can improve wafer surface finishes, enhance device performance, and yield higher mechanical planarity. SPITFIRE SP-F888-72 is designed to be highly efficient and includes several features to ensure the highest quality results. These include a motorized, height-adjustable precision gantry table, which enables fast and accurate positioning of the grinding wheel; a programmable speed control tool for precise control over the process; a dust extraction asset for reducing dust emissions; and a temperature sensor for more consistent results. SP-F888-72 is a cost-effective solution for wafer grinding, lapping, and polishing systems. It is designed to provide consistent results and meet a wide range of production demands. Combined with its low maintenance design and intuitive controls, SPITFIRE SP-F888-72 is the perfect choice for those looking to achieve precision and accuracy in their wafer processing needs.