Used SPITFIRE SPGYR-4-48 PNLC #9025269 for sale

SPITFIRE SPGYR-4-48 PNLC is a user-friendly, ultra-precision wafer grinding, lapping and polishing system. It features a fully automated, high speed, computer controlled centerless grinder, a precision lapping pad with integrated finesse lubrication, and a proprietary polishing head design. SPGYR-4-48 PNLC is equipped with a four-axis sample holder that can hold up to four samples at a time, enabling a high throughput solution. In addition, its accuracy is enhanced by an integrated vision-and-encoder system which monitors the feed rate of the positioner and makes length adjustments, ensuring consistent results. The grinder module consists of a highly efficient grinding wheel which is driven by a 2000W brushless DC motor and is capable of grinding wafers from 25µm to 1500µm. The adjustable grinding gap allows for easy setting of the grinding level. The grinding wheel is enclosed by a protective grinding hood, which reduces particles and minimizes the noise level. The integrated vision system also ensures accurate positioning of the wafers and enables the machine to automatically adjust to their edge radius. The precision lapping pad features a large area coverage of 48 inches and has a grooved surface pattern which ensures an even material removal process. This process is further accelerated by the fine lubrication mechanism embedded in the pad. The polishing head module is composed of a rotational spindle driven by a brushless motor. The head is equipped with oxygen-detached bonded abrasives of up to 5µm. The polishing head also features a special design which guarantees uniform polishing process on the wafer surface. SPITFIRE SPGYR-4-48 PNLC is an advanced wafer grinding, lapping and polishing solution, ideal for users who need a versatile and cost-effective machine with a high level of precision. Its user-friendly design and integrated technologies make it easy to use and configure according to specific requirements. The machine is highly suitable for the processing of semiconductors, test chips, data storage and application-specific ICs.