Used SPM WST #293603623 for sale

SPM WST is a wafer grinding, lapping, and polishing equipment based on SPM (Specialized Purpose Machine) platform. It is suitable for wafer grinding and polishing for manufacturing and research applications. The system is designed to enable users to grind and polish wafers to the specified parameters for high-precision wafer shaping and fabrication. WST unit has two main components - the production machine and the grinding machine. The production tool includes two main parts: the loader, where the wafers are loaded, processed, and unloaded; and the robot arm, which positions the wafers within the chamber and interacts with the grinding machine. The grinding machine is designed to rotate and grind the wafers using a precise asset of grinding and polishing heads. SPM WST model can also be used to perform coarse and fine grinding as well as polishing operations, depending on the requirements of a specific application. WST equipment is designed to accommodate a variety of wafer manufacturing processes such as lapping, grinding, polishing, deburring, and edge masking. The system is capable of automatically loading and unloading the wafers and can process wafers of different sizes and materials. The grinding process is executed with accuracy and precision and is monitored by an internal control algorithm to ensure production of high-quality results. The grinding machine is also equipped with protective features to safeguard the unit from overheating and unintentional damage. SPM WST machine is a state-of-the-art machine, providing a combination of precision engineering, automated operation, and high-level customization for various wafer processing tasks. It ensures that users can obtain good wafer grinding, lapping, and polishing results in a safe and efficient manner.