Used SPM Y-06147A #9181616 for sale

SPM Y-06147A is a wafer grinding, lapping, and polishing equipment that is designed for precise deburring and finishing of semiconductor materials such as sapphire, silicon, quartz, quartz glass, and garnet. This system consists of a highly efficient automated grinding and polishing structure composed of a grinding stage, a lapping stage, and a polishing stage. The grinding stage of the unit uses a grinding disk that can generate a desired surface roughness with minimal depth of cut. The grinding disk is used to produce a flat and parallel surface with nanometer-level accuracy. The lapping stage is equipped with a vibratory lapping head and provides automated low-pressure and low-velocity grinding and polishing. This process allows for the production of ultra-smooth surfaces with low roughness levels. The polishing stage consists of a polishing wheel that polishes the wafer to a high degree of accuracy. This machine features a low-vibration structure that reduces vibration caused by the lapping and polishing stages and minimizes the impact of thermal gradients on the wafer. Additionally, it has a water-cooled tool that decreases the temperature in the grinding chamber and improves the consistency of the grinding and polishing process. The asset is equipped with an automated operator interface model that provides a wide variety of equipment functions that enable efficient operation and advanced control in production process. Y-06147A is a reliable and highly efficient wafer grinding, lapping, and polishing system that is tailored for the processing of semiconductor materials. This unit features low-vibration, temperature stabilized design, and automated operator interface systems that produce accurate and reliable results. It is an ideal choice for all production line operations where reliability and accuracy in production processes are of great importance.