Used SPM Y-08441A #9153426 for sale

SPM Y-08441A Wafer Grinding, Lapping & Polishing equipment is an advanced two-stage process for processing and finishing semiconductor wafers. It's an automated system driven by a given instructions and comes with a WX-1150 step motor for total velocity control. This unit is designed to improve semiconductor wafer finish with uniform flatness and smooth finish. Y-08441A machine comes with a gratinating table (abrasive surface) that can be adjusted in 3 directions (X, Y, and Z). This gratinating table has adjustable table tilt for ensuring smooth wafer processing. This tool is also equipped with a special grinding head that spreads and moves the grinding stone. This grinding head is designed in a way to make sure that wafers receive even abrasive fraction from the grinding stone. The 2nd stage of the process is the lapping and polishing stage. This asset is equipped with a diamond-coated polishing surface that is adjustable for wafer thickness. This polishing surface can be manually adjusted with the help of a turn wheel. This model also consists of a wafer up-down wheel for transferring the wafer on the polishing surface. It also contains a spray-nozzle for washing away the abrasive particles in order to clean the wafer. SPM Y-08441A equipment is equipped with a digital control system for controlling machining speed, feeding speed, and working pressure. This unit can be operated both in electrical and semi-manually mode depending on the requirement. The electrical speed controlling machine can be programmed to store various machining steps and can be performed with one button click. Its PLC (Programmable Logic Controller) controls the overall process. The tool is equipped with safety features too. The spindle safety switch automatically cuts off the power in case of any abnormal safety condition. This asset also comes with a coolant leakage sensor to detect and inform the operator if any coolant leakage is there. Y-08441A model is highly reliable and suitable for wafer grinding, lapping and polishing for a wide range of applications. This equipment reduces person-hours spent on manual processing and helps to save costs significantly. This system can also be used for advanced customized applications such as surface grinding, slotting, sharpening, beveling, etc. Its superior performance, speed control and flexibility make it suitable for the processing of wafers for various kinds of industries.