Used SPM Y-08443A #9153427 for sale

SPM Y-08443A is a fully automated wafer grinding, lapping, and polishing equipment designed with the advanced manufacturing processes of the semiconductor industry in mind. It is capable of performing multiple grinding and polishing steps in one integrated machine, increasing productivity and repeatability. This can save costly time and money. The system is also easy to use, with an intuitive touchscreen interface allowing operators to quickly program and operate the machine. The user friendly design also allows for quick set up and changeover times. Y-08443A features a choice between an electro-mechanical grinding-wheel unit, or a rotational-disc polishing machine. The electro-mechanical tool is best suited for applications such as pre-processing of heavy wafers or large array production. The rotational-disc asset is used to polish fine-line array structures or strained silicon wafers. The precision motor-driven drives and motion controls provide high accuracy and repeatability. The model also incorporates precise positioning technology, ensuring that the exact targeted points of the wafer surfaces can be reached. Furthermore, the advanced technological solutions ensure high quality results. This includes a high-resolution camera with a dedicated automated vision inspection equipment that allow for precise part verification and material handling functions. Additionally, the process control and traceability features allow for reproducible results. SPM Y-08443A also features different optional equipment that can further increase precision and productivity. These include an automatic deburring system that can help to remove sharp edges from the polished surfaces, as well as surface metrology and particle inspection systems. The automatic edge deburring unit reduces overall steps needed to obtain the desired result and creates a more uniform surface. The surface metrology and particle inspection systems allow for improved visibility of the product features and for quick detection of any microscopic irregularities. In summary, Y-08443A is an essential machine for the semiconductor industry. Its advanced and intuitive technology provides multiple versatile grinding, lapping, and polishing capabilities in one integrated machine that saves time and money while producing repeatable, high-quality results. With many customization options, this tool is sure to meet the needs of any demand.