Used SPM Y-08480A #9181603 for sale

SPM Y-08480A wafer grinding, lapping and polishing equipment is an ideal solution for the production of planarized wafers on both sides. This machine is designed for precision abrasion and polishing of large diameter silicon wafers. With its combination of precise grinding and lapping processes, Y-08480A is a flexible platform capable of achieving high-quality results. The system is equipped with a high-precision, three-axis CNC motion control unit for both grinding and lapping, as well as a fully programmable grind and lapping process. The control machine allows for the platform to achieve flexible stop, start, and repeat positions to achieve superb results in complex geometries. SPM Y-08480A also features a liquid cooling tool to ensure that the wafers do not become overheated during the grinding and lapping process. Y-08480A is capable of grinding and lapping wafers up to 200 mm in diameter and up to 5 millimeters thick. This asset can planarize both sides of a wafer simultaneously, with a result that meets all the preset specifications. Furthermore, the machine is designed to perform a range of grinding, lapping and polishing processes. It can use diamond and resin abrasives, as well as select samarium cobalt or neodymium magnets. The model also features full automatic protection systems, which ensure uninterrupted operation of the machine even in the event of a power failure. Additionally, the CNC motion control allows for the equipment to be connected to a Computer Aided Design (CAD) system, allowing for the use of preset grinding and lapping programs. SPM Y-08480A is capable of providing excellent results in terms of efficiency, accuracy and repeatability. Its combination of precision in grinding and lapping processes, as well as its flexibility in grinding and lapping processes, makes it an ideal solution for the production of planarized wafers on both sides.