Used SPM Y-09065A #9153429 for sale

SPM Y-09065A is a wafer grinding, lapping and polishing equipment designed to provide solutions for polishing applications involving the fabrication and/or packaging of advanced microelectronic devices. The system is equipped with a wide range of quiet and high performance motor which enable precise and efficient grinding, lapping and polishing of wafer surfaces. It is able to accommodate wafers up to 200mm in diameter and has an auto-index capability which enables continuous grinding, lapping and polishing of individual wafers. Y-09065A grinds, laps and polishes using a combination of grinding wheels, abrasive belts and polishing pads. It is equipped with two high torque spindles which operate at speeds from 0 to 126 revolutions per minute and provide finely tuned surface finishes of up to 0.12 μm RMS in high aspect ratio applications such as TSV and substrate voids. The unit utilizes advanced motion control and vision technology to ensure the precise positioning of the grinding & polishing pucks with respect to the wafer's surface. The use of a kinematic polishing head block further provides stability and accurate surface control while achieving the surface finish. Air-bearing technology enables SPM Y-09065A to use a single motor to drive all processes, while at the same time providing superior vibration isolation and low-power consumption. Its vibration-free operation allows it to achieve superior surface profile, flatness and ultra-smooth finishes. The machine includes a hydrostatic lubrication tool which increases the life of the spindle motor and tooling by reducing friction and wear and eliminating lubrication-related maintenance costs. Y-09065A is capable of producing high-quality finishes with outstanding repeatability for a fraction of the cost of competing systems. Its cost effective design eliminates the need for additional accessories, making it the ideal choice for high throughput and cost saving applications. The asset is compatible with a wide variety of grinding, lapping and polishing materials and can be customized to meet a variety of application needs.