Used STAHLI 700 #9215670 for sale

STAHLI 700 is an advanced wafer grinding, lapping and polishing equipment designed to produce ultra-smooth surfaces on semiconductor and other hard materials. The system is suitable for applications such as ballistic and geometrical surface finish, dicing and lapping, grinding/flattening of grinders, and polishing. 700 employs state-of-the-art grinding technology to achieve optimal performance. It has a powerful, 6-axis CNC machine for grinding that was developed to encompass flexibility in part programs with a high degree of accuracy. The unit also has a 5-axis grind spindle for lapping and polishing that can be dynamically configured for optimal performance. The machine's design is based on an automated self-learning cell structure that features automatic monitoring and processing of jobs, as well as automatic process adjustment for optimal grinding performance. It also features an automatic positioning and depth control tool for accurate part processing, and can be programmed for an unlimited number of part types and sizes. The grinding process is optimized by the advanced CLIPPER process control asset, which combines advanced vibration analysis, adaptive feedrate control and predictive motion control to ensure optimal performance. The model also has a built-in laser light-based surface measurement equipment to provide feedback for process optimization. STAHLI 700 uses a unique diamond grinding material with superior grinding capabilities, as well as a high radial stiffness, that produces smooth surfaces with minimal deformation and excellent uniformity. This ensures ultra-smooth surfaces on both hard and soft materials. The system is easy to use machine-side programming and a simple user interface that facilitates data entry and process optimization. It has integrated caviar abrasive modules, which allow for faster and more accurate grinding, and the modular concept enables easy upgradability. 700 is also capable of unprecedented speed and accuracy, making it one of the most advanced wafer grinding, lapping and polishing systems available.