Used STAHLI KD 66-4-KL #9263415 for sale

The STAHLLI STAHLI KD 66-4-KL is a state of the art wafer grinding, lapping & polishing equipment. This sophisticated system offers an ideal combination of flexibility, accuracy and production performance. The unit is designed for the grinding, lapping and polishing of flat surfaces on wafers in two axes X and Y. The machine is provided with a fully enclosed machine table and housing, covered by removable panels for access and safety. The heart of the tool is the grinding/lapping/polishing multifunction table which moves in X and Y direction offering an ability to process rectangular as well as elliptic workpieces and provide exceptional surface finish for both thin and thick wafers. The platform provides a built-in automatic work centering asset to ensure accurate loading position for all kinds of wafers. The grinding/lapping/polishing process is controlled by a numerical control operating model that is compatible with a wide range of programming languages. The equipment also includes a precision-controlled turning table that can handle both elliptic and rectangular wafers simultaneously. Furthermore, the system provides variable speed control which allows for hard or soft grinding, lapping and polishing processes. The turning table is adjustable in the range of 0-15 degrees for perfect tapered grinding and lapping. Additionally, the unit is equipped with adjustable diamond media which ensures that the process is applied to the wafer evenly. The diamond media, grinding/lapping/polishing tools, as well as other consumables, are stored in convenient drawers within the table to provide quick and efficient access. The machine is equipped with pneumatic clamping and vacuum loading systems which significantly reduce cycle time and wear on the components. Safety features include safety interlocks which ensure that the process is carried out safely and correctly. The STAHLLI KD 66-4-KL is a first-class tool that is capable of providing superior product quality, increased efficiency and productivity in the grinding, lapping and polishing of wafers. The highly accurate and controllable asset is suitable for a wide variety of applications.