Used STAHLI SMF 350 #9185066 for sale

STAHLI SMF 350 is a wafer grinding, lapping, and polishing system designed to provide extremely consistent surfaces for high-precision processes. SMF 350 coordinates its robotic arm movements with its automated grinding and lapping belt motions, allowing for efficient and consistent surface preparation. It is capable of processing wafers up to 300mm, with variable materials such as silicon, quartz, and sapphire. The grinding, lapping, and polishing process begins with the automated preparation of the sample. The sample is loaded into the chuck of STAHLI SMF 350, where high-precision motors rotate it to the proper rotational speed. The chuck is then moved to the grinding area, where a grinding belt applies normative pressure to achieve the desired surface finish. After the grinding phase is complete, the sample is transferred from the chuck to the lapping area. Here, two oscillating lapping belts using diamond abrasives are used to further refine the surface of the sample. These diamond abrasives are highly efficient, providing uniform finish with no impact damage or residue. Finally, the sample is transferred to the polishing area. This area features moving polishing pads, coupled with a specialized paste, to provide the desired surface texture and finish. The polishing process can be tailored to produce a variety of different surface finishes including mirror, cloudy, and brush. SMF 350 is a reliable and efficient system, allowing for high-precision and high-speed processing of workpieces. With various automated processes, STAHLI SMF 350 combines a high degree of accuracy with consistency, making it an ideal wafer grinding, lapping, and polishing system.