Used STEHLE S913G #170060 for sale

STEHLE S913G is a sophisticated wafer grinding, lapping, and polishing equipment designed specifically for the needs of the modern semiconductor production line. The system is capable of grinding, lapping, and polishing a wide range of wafers using the latest state-of-the-art technologies, such as Nano grinding technology (NGT), and its lapping process enables the production of thinner wafers with precise grooving for clean cuts. The advanced machine-tending capabilities also allow for precise and precise repeatability which can drastically reduce downtime and increase efficiencies on the production line. The unit's robust automation enables precise control over the grinding and polishing process, allowing for repeatable numerical parameters such as grinding speed, feed rates, and polishing pressures. Furthermore, S913G also has safety sensors in place to immediately stop the machine if any deviation from the pre-programmed parameters is detected. STEHLE S913G is designed for high-precision processes, with the ability to precisely lap a wide range of materials at high speeds. The stepper motor-driven lapping plate is a turbo-charged lapping plate which moves three-dimensionally in order to ensure uniform production results. Additionally, there is a programmable lapping plate, which can be programmed to alternate between high-speed and low-speed lapping cycles to ensure the highest quality and strongest bond possible. To ensure the consistently high standard of the finished product, S913G boasts a Diamond Immersion machine which is able to coat the wafer surfaces and the lapping plate with diamond solution. This diamond coating further hardens the wafer surface and gives a smooth finish, allowing for just the right amount of shine and clarity that is essential for precision polishing and grinding processes. Moreover, STEHLE S913G is equipped with an advanced filtration tool and a central liquid relief asset that removes particles and contamination from collected slurry and coolant. The model is fitted with removable quick-change filters for cleaning problems and preventive maintenance, saving on downtime and reducing the risk of downtime caused by filter blockage. In conclusion, S913G is a cutting-edge wafer grinding, lapping, and polishing equipment that is capable of producing wafers of the highest quality and precision to the exacting standards required by today's semiconductor production line. The advanced automation, precise control, and heavy-duty construction makes this system the perfect choice for any semiconductor production facility, ensuring consistent quality and high performance at a fraction of the cost.