Used STRASBAUGH 6AI-DC-6 #293818956 for sale

STRASBAUGH 6AI-DC-6 is a high-precision, multi-process wafer grinding, lapping, and polishing equipment. It is designed for production grinding of thin and thick substrates with flatness requirements better than 10 nanometers. This machine is built with an adjustable 1000-2000 RPM direct-drive grinding spindle, which allows for grinding operations to occur with minimal thermal damage and high precision surface finish. It is equipped with 6" size grinding plates that support up to 25 particles per grinding cycle for high throughput and highly efficient results. 6AI-DC-6 utilizes a grinding force and pressure control system to ensure that the grinding operation is carried out with optimized conditions to meet specific requirements. STRASBAUGH 6AI-DC-6 machine is also designed with a high-precision lapping and polishing unit, consisting of a 3 axis contouring head and a 6" lapping disc. The 3 axis contouring head allows for accurate precision diamond lapping operations at ultra-low speeds, while the lapping disc helps with maintaining high chip removal rate and superior surface finish. This product also comes with a variable speed 600-1500 RPM arm polishing machine, which can be used for both production and precision finishing operations. 6AI-DC-6 tool is designed with a user-friendly interface, and includes on-board diagnostics and fault identifying software to help users quickly identify causes of problems that may occur during production. This product also comes equipped with a high-accuracy air-bearing linear motor stage, which is used for precise stage motion during both grinding and polishing operations. STRASBAUGH 6AI-DC-6 is capable of grinding and polishing wafers with dimensions ranging from 2" to 10" in diameter. It also features a configurable software interface that allows users toedit grinding and polishing parameters to customize the asset to their specific needs. In conclusion, 6AI-DC-6 is a high-precision wafer grinding, lapping, and polishing model designed for production grinding of thin and thick substrates. This machine is capable of accurately achieving flatness requirements better than 10 nanometers with an adjustable 1000-2000 RPM direct-drive grinding spindle. It is equipped with a 3 axis contouring head and a 6" lapping disc for precise diamond lapping operations, and includes a variable speed 600-1500 RPM arm polishing equipment for both production and precision applications. This product is also designed with a user-friendly interface, and includes a high-accuracy air-bearing linear motor stage.