Used STRASBAUGH 6AK #20941 for sale

STRASBAUGH 6AK wafer grinding, lapping and polishing equipment is a state-of-the-art system designed specifically for the precision grinding and lapping of wafers with extreme accuracy at a low cost. It is designed to offer superior accuracy, reliability and repeatability of results, making it the perfect choice for cutting-edge research in the semiconductor industry. It is constructed with a durable stainless steel base, a single axis motion with a maximum of four (4) separate modules which include wafer grinding/dicing module, lapping/polishing module, cleaning module and a wax-dispensing module. The grinding/dicing module of 6AK features a precision CNC gantry for grinding wafers into different shapes. The grinding process is done by the computer command driving a special shape grinding wheel to remove the required shape from the top surface of the wafer. The precision of the shape is achieved by the careful control of the grinding wheel speed, stroke length and amplitude of the motion. In addition, STRASBAUGH 6AK also features a lapping/polishing module which utilizes a closed loop servo control that allows for accurate control over the surface condition of the wafer. It is equipped with a special multi-axis diamond head for surface finishing of wafers, including back surface processing and 3D profile processing. This eliminates the need for manual surface polishing or polishing with traditional two-axis systems. The cleaning module of 6AK uses a double-spin cycle rinse process to thoroughly remove particles from the surface of the wafer without damaging them. It is specifically designed for cleanroom environments and has a high-pressure spray that removes particles from both the inside and the outside of the wafer. Finally, the wax-dispensing module helps in providing a protective layer to the wafer surface which helps reduce sticking and wear resistance. This allows the wafer to withstand extreme temperatures and wear during processing. The wax-dispensing module is designed to evenly spread a thin layer of wax on the surface of the wafer, significantly improving its performance during processing. Overall, STRASBAUGH 6AK wafer grinding, lapping and polishing unit is a revolutionary machine that is designed to ensure the accuracy and repeatability of results while significantly reducing costs. It can be combined with advanced automation systems and provides seamless integration with any data acquisition tool. 6AK is the perfect choice for any research or manufacturing environment in the semiconductor industry.