Used STRASBAUGH 6BA-3 #293794304 for sale

STRASBAUGH 6BA-3 wafer grinding, lapping and polishing equipment is a powerful and versatile tool for the precise finishing of semiconductor wafers and discrete components. It is a highly automated system designed to enable surface grinding and polishing of planar and non-planar materials from the same platform. 6BA-3 unit uses a patented closed-loop control package and electrical feed systems to enable precise control over part topography while maintaining a high level of repeatability. STRASBAUGH 6BA-3 machine provides a wide range of lapping and polishing capabilities ranging from 500 up to 1200 grit. A unique feature of 6BA-3 tool is the ability to select from various sizes and densities of grinding/polishing plates to perform a varied range of grinding, lapping and polishing operations. The plates can be aligned to precision tolerances and can be refaced as needed with a reconditioning ring thereby extending the lifetime of the abrasive surfaces. The abrasive surface and lubrication used is optimized for each operation resulting in maximum performance and efficiency. The wafer processing asset uses a precision auto-indexing carousel to transfer the wafers through seven different operation cycles. During these cycles, the wafers are ground, lapped and polished to a specified topographic profile and either a polished "H" or "V"-groove finish. The profile and finish can be controlled through various process parameters such as abrasive particle size, pressure, and carrier motion. This flexibility of operations means that STRASBAUGH 6BA-3 model can be used to finish a broad range of applications including deep grinding, flat grinding, counter-bore grinding, edge grinding, lapping, and polishing in a single equipment. 6BA-3 system is easy to set up and operate, with a user friendly graphical interface and intuitive touch-screen controls. The entire unit is temperature-controlled, enabling a wide range of process settings from -18°C to 150°C. This temperature control aspect allows the user to optimize grinding and lapping operations by preventing the acid degradation of the abrasive particles. Further, STRASBAUGH 6BA-3 machine is designed for rugged and reliable long term use. It is built with stainless steel components and features a modular design to allow for efficient maintenance and upgrades. All materials used in the tool are designed to minimize chemical and thermal damage to the workpieces while providing the necessary accuracy and repeatability for the applications that the asset was designed for. In summary, 6BA-3 wafer grinding, lapping and polishing model is a high-quality, automated equipment with a wide range of options which allows the user to quickly and accurately finishing wafers and discrete components. With its user-friendly interface and rugged reliability, the system is ideal for performing sophisticated grinding, lapping, and polishing operations with minimal effort.