Used STRASBAUGH 6BD-3 #9208244 for sale

ID: 9208244
Lapper, 36" Conditioning rings & manual included.
STRASBAUGH 6BD-3 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to provide superior performance and consistency in the grinding process of hard and brittle semiconductor materials. This unique grinding system uses a combination of a fully-programmable microcomputer-controlled motion drive, a precision-controlled speed range, and an advanced unit design to produce high-precision grinding results, with maximum part-to-part repeatability. The machine is capable of a wide speed range, with a maximum speed of 6,000 revolutions per minute (RPM). Its drive tool is designed to minimize vibration and produce uniform motion, while its efficient energy utilization helps to reduce the cost and environmental impact of grinding. Its control asset also allows for enhanced repeatability and flexibility in the programmable grinding parameters. This enables users to optimize the grinding outcomes for a variety of materials, including semiconductor wafers, ceramics, metals, and polymers. 6BD-3 also incorporates advanced polishing capabilities, such as the ability to vary the finishing abrasive size and type, to tailor the polishing process to the material's properties. Its variable speed range and precise control also make it possible to achieve high production yields and maximize throughput. The model's integrated lapping station allows for the quick swap of multiple lapping plates from a single station, and enables users to create unique, customized lap profiles. Finally, STRASBAUGH 6BD-3's integrated high-tech grinding heads feature a proprietary design which provides a combination of superior grinding quality and optimal durability. This unique design helps to ultimately reduce the total cost of ownership over the equipment's lifetime. With its ability to handle multiple types of materials, as well as its state-of-the-art grinding, polishing, and lapping capabilities, 6BD-3 is an ideal system for a variety of wafer grinding, lapping, and polishing applications.
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