Used STRASBAUGH 6BK-DC-SP #9390295 for sale

STRASBAUGH 6BK-DC-SP is a wafer grinding, lapping and polishing equipment used in the semiconductor and integrated circuit industries. It is a fully automated, dry process system with robotic cassette to cassette loading and unloading. 6BK-DC-SP is capable of grinding and polishing up to 8" wafers with a maximum .004" overall reduction. STRASBAUGH 6BK-DC-SP unit is comprised of several major components that work together to produce the desired result. The machine itself consists of a synchronous robotic loader and unloader, wafer grinding, high speed lapping and diamond polishing machines, a wafer inspection stage, a telescoping furnace, a control tool and an operator's console. The wafer grinding machine is the core component of the asset which is responsible for grinding the wafers to the desired shape and surface finish. It utilizes abrasive grinding wheels that are precisely calibrated to produce the desired results while maintaining tight tolerances. The lapping and diamond polishing machines are responsible for further smoothing and polishing of the wafer surface. The lapping machine uses a combination of chemical and mechanical forces to rapidly polish the wafers. The diamond polishing machine utilizes a highly abrasive diamond slurry to give the wafer a glass-like finish. The wafer inspection stage is used to check the quality of the wafer surfaces before they are processed. The telescoping furnace is used to thermally process the wafers before they are delivered to the next stage of production. 6BK-DC-SP's control model is responsible for programming, loading and unloading of the robotic loader and unloader, powering the grinding and polishing machines, controlling the telescoping furnace temperature and providing a user-friendly interface for the operator. STRASBAUGH 6BK-DC-SP equipment is designed for maximum efficiency and delivers fast, precise results with minimal operator supervision. It can process up to 8" wafers from start to finish in a single run and is easily programmable for different wafer sizes and shapes. The system is also designed for easy maintenance and fast recovery with minimal downtime for servicing.