Used STRASBAUGH 6BL #9137737 for sale

ID: 9137737
Polisher.
STRASBAUGH 6BL is a wafer grinding, lapping and polishing equipment for a diverse range of applications including photonics, semiconductor, biomedical, MEMS, optical and thin-film manufacturing. It offers a high level of precision at each step of the grinding, lapping and polishing process. 6BL system uses a planetary base motion to achieve a consistent, high-precision finish. It is capable of grinding, lapping, and polishing large and small wafers and can accommodate substrates up to 8 inches in diameter. The machine is designed to achieve low particle contamination levels and is constructed with extensive operator safety features. The unit offers an easy to use interface with configurable automated functions, including start-up, shut-down, lapping and polishing times, wafer orbits, and specific speed control settings. With a range of grinding capabilities, including surface and edge grinding, sub-micron particle removal, and wafer thinning, STRASBAUGH 6BL machine is well suited to a range of finishing requirements. 6BL tool incorporates a unique triple-axis nature of the planetary base, with their X, Y and Z axis. An extremely accurate and fast repeatability is achieved with the X and Y axes working in tandem, both controlled by AC servomotors. As each of these axes progresses, they internalize the contact pressure and naturally produce a spherical shape to the substrate. The Z axis is composed of a highly-accurate micrometer, which monitors and precisely controls the desired contact pressure to ensure substrates are ground to their target shape. The asset offers an intuitive and user-friendly interface, providing simple navigation menus and screens for intuitive operation. The easy-to-use touchpad controls, featuring preset programs and digital menus, enables an operator to quickly set up and run the model. The equipment has a high-efficiency dust and particulate containment system that helps reduce operator exposure to hazardous particles. STRASBAUGH 6BL unit offers a highly accurate machine for wafer grinding, lapping and polishing that can handle a wide range of substrates in the semiconductor, MEMS, and optical industries. With its high speed, precision, and low contamination rate, 6BL is the ideal way to ensure top quality surface finishes with excellent repeatability.
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