Used STRASBAUGH 6BU #9045660 for sale

STRASBAUGH 6BU is a wafer grinding, lapping and polishing equipment used for wafer preparation and for the manufacture of semiconductor devices. 6BU is a lightweight, high precision system that has been designed to precisely grind, lap and polish up to 6 inch wafers. It features an integrated lap plate, a motorized grinding wheel, and an air bearing spindle. The unit is designed to achieve tight specifications, including smooth surfaces, flat surfaces, sharp edges, and high uniformity. STRASBAUGH 6BU features an integrated lap plate that is used to hold the wafers during grinding and lapping operations. This lap plate is constructed from a highly heat-resistant and low-friction material which is designed to provide superior surface conditioning during grinding and polishing operations. The lap plate also features an adjustable depth control machine which allows the operator to precisely control the depth of the grinding and lapping operations. 6BU also includes a motorized grinding wheel, which allows for the accurate grinding of the wafer's surfaces. This grinding wheel is driven by a high-power motor that provides an efficient and repeatable process. The grinding wheel is also outfitted with a tool-less tool for easy and precise adjustment of the cutting depth. STRASBAUGH 6BU also features an air bearing spindle, which provides superior accuracy and performance when polishing wafers. The spindle is controlled by a highly programmable software that features automated and manual operation modes. The software also provides for the easy adjustment of parameters such as travel speed, rotary speed, and spindle drive current, allowing for precise control. In order to ensure precision and accuracy, 6BU is outfitted with a suite of peripherals, including a durable two-channel spindle speed monitor and a cutting edge vision asset. The vision model uses high-resolution digital cameras to monitor the progress and quality of the grinding, lapping and polishing operations. The vision equipment is also used to automatically identify and move defective wafers away from the grinding and lapping operations for further inspection. STRASBAUGH 6BU is a lightweight, high-precision wafer grinding, lapping and polishing system that is designed to achieve tight specifications with high accuracy. The integrated lap plate, motorized grinding wheel, and air bearing spindle provide superior performance and repeatability. The unit is outfitted with a suite of peripherals, including a two-channel spindle speed and a vision machine for accurate monitoring. 6BU is ideal for wafer preparation and the manufacture of semiconductor devices.