Used STRASBAUGH 6BZ #9195513 for sale

Name: STRASBAUGH 6BZ
Brand: STRASBAUGH
SKU: 9195513
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

STRASBAUGH

Model

6BZ

ID: 9195513

Precision lapping machine, 96" (4) Hold downs / Rings Variable speed Inner dimension: 36" Specifications: Lap plate diameter: 96” Inside diameter of table: 24” Face width of table: 36” Work ring offset range: 2” Table: Speeds: 0 to 20 R.P.M. Torque at 10 R.P.M.: 30000 In. Lbs Load rating: 13500 Lbs Equipped with: Diameter cast iron segmented lapping plate, 96” (4) Retaining rings (4) Pneumatic air pressure heads Main drive motor & controls: 30 HP Cycle timer control Air pressure gauges Variable speed controls for table Currently installed.

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STRASBAUGH 6BZ wafer grinding, lapping & polishing equipment is an automated system that can be used to improve the surface quality and performance of silicon and other hard materials. The unit uses a combination of abrasive forces and chemical slurries to achieve the desired results. The machine is composed of a grinding head assembly, a polishing head assembly, a wafer-holder, an adjustable lapping or polishing table, and a pneumatic lift. The grinding head assembly consists of a 6-inch externally-powered polishing head, which is capable of producing a uniform 1-5 µm surface finish on all types of wafers. The grinding head also features a 7-degree tilting angle capacity and has a 40-pound load capacity. The polishing head assembly is used for finishing and sealing of surface irregularities. It consists of a 4-inch externally-powered polishing head, which produces a 10-15 µm surface finish. The polishing head is adjustable and also features a 7-degree tilting angle capacity and a 40-pound load capacity. 6BZ features a wafer-holder that can be used to hold and secure silicon wafers of various sizes. The wafer-holder is adjustable and allows for quick and precise rotation of the wafer. The adjustable lapping or polishing table is designed to allow for quick changes to the grinding or polishing process. The table is adjustable in height and angle, and is able to accommodate a variety of grinding and polishing forces. Finally, the pneumatic lift allows the user to quickly and precisely adjust the angle of the grinding or polishing heads, and it is adjustable in height and angle. STRASBAUGH 6BZ is an automated wafer grinding, lapping & polishing tool that is designed to provide a smooth, uniform finish on silicon and other hard materials. The asset includes a grinding head assembly, a polishing head assembly, a wafer-holder, an adjustable lapping or polishing table, and a pneumatic lift. Together, these components provide the user with a fast, efficient and precise wafer grinding, lapping & polishing process.