Used STRASBAUGH 6CA #9265720 for sale

STRASBAUGH 6CA Wafer Grinding, Lapping & Polishing equipment offers a comprehensive set of capabilities for highly precise and efficient wafer processing for the most demanding applications. STRASBAUGH 6 CA is capable of grinding, lapping and polishing any wafer, from the most delicate, to the most extreme. It also makes use of many automated options to optimize processing time while minimising labour costs. The production line on 6 C A is designed to bring highly precise and efficient wafer grinding, lapping and polishing processes to the user. 6 CA is equipped with both a single-wafer and continuous-wafer side, for highly efficient grinding, lapping and polishing operations. It also has options for automated wafer handling and sorting to further enhance efficiency. STRASBAUGH 6 C A integrates a number of features to assist with precise wafer surface finishes. It has an adaptive spindle design that enables it to process both flat and non-flat wafers and it is also equipped with a high-precision spindle motor that enables it to achieve the highest precision of surface finish. 6CA also features Diamond and Silicon carbide polishing solutions with a 3-step polishing process - standard, medium-fine and Ultrafine polishing - enabling it to cater for different wafer requirements. STRASBAUGH 6CA is also equipped with a unique "Visual Alignment" system, which enables it to detect the orientation of the wafer for more precise and efficient grinding and polishing operations. Additionally, the automated grinding and lapping unit on STRASBAUGH 6 CA is able to achieve a very high level of wafer surface perfection with very little operator intervention. Furthermore, 6 C A has numerous automation features including a wafer inventory management unit, robotics, automated robotic load/unload, a wafer tracing machine and an automated wafer thickness monitoring tool. 6 CA's various automation options enable it to operate without operator interventions and to process wafers with precision, continuously and at very high-speeds. Overall, STRASBAUGH 6 C A Wafer Grinding, Lapping & Polishing asset is a highly advanced and feature-rich model that offers a range of automated options for optimized wafer processing. 6CA helps to reduce costs by providing precision wafer processing, with minimal manual labour, while also delivering high speed production and unmatched reliability.