Used STRASBAUGH 6DE-1 #9083405 for sale

STRASBAUGH 6DE-1 is a computer-controlled wafer grinding, lapping, and polishing equipment. It is used in the deposition process to make semiconductor wafers ready for the next stage of the manufacturing process. The system hinges upon strategically-placed diamond-embedded grinding wheels and utilizes automated wafer positioners to perform precise parallel grind faces, electro-polishing, and precision-profile management. 6DE-1 can process up to two wafers per cycle with a typical diameter range between 2" and 6". The unit includes an industrial-grade microprocessor that controls the movements of the robot to ensure proper orientation and grinding of the wafers. The movements of the robot are precise and repeatable, minimizing chip-to-chip variances in the end product. The machine is controlled and monitored via a user-friendly LCD touch screen interface, allowing operators to easily enter parameters, monitor progress, and troubleshoot issues while keeping a real-time record of all stages of the process. In addition to the grinding and lapping processes, STRASBAUGH 6DE-1 also includes an integrated polishing chamber. This chamber includes a diamond slurry and cleaning station which further refines the surface of the wafer to meet quality criteria. This step is critical for getting the best results, as this is where the majority of the abrasion, chemical and fine-polishing processes take place. The polishing chamber also has a low-profile design and digital vacuum control for optimum process control setting and best-in-class throughput. The machine is controlled by a customizable software suite which allows users to analyze the efficiency, reliability, and consistency of the output. The software makes it easy to control the machine, store processing information, and generate report documentation. In addition, 6DE-1 also comes with a range of safety features, such as an emergency stop switch, protective shields, and alarms to alert operators of equipment malfunctions. STRASBAUGH 6DE-1 is designed to provide the highest levels of quality and performance in wafer grinding, lapping, and polishing. Its industry-leading design, automation, and quality assurance features make it an attractive option for wafer manufacturers all over the world.