Used STRASBAUGH 6DE-4 #9025071 for sale

STRASBAUGH 6DE-4 is a powerful wafer grinding, lapping and polishing equipment designed for production throughput. Its unique configuration provides a one-step operation with no need for re-positioning of the wafer. 6DE-4 is capable of performing all wafer grinding, lapping and polishing operations with a single platform, delivering the highest levels of process control and repeatability. STRASBAUGH 6DE-4 utilizes dual-drive, precision-ground surfaces mounted on a rotating turntable, which enables the grinding, lapping and polishing of multiple wafers simultaneously. The system uses an open-loop motion control that allows for precise positioning of the wafers and the highest quality polishing performance. 6DE-4 also benefits from a robust, all-metal frame and protective cover to ensure accuracy and protection during operation. To further optimize production efficiency, STRASBAUGH 6DE-4 utilizes automated grinding, lapping and polishing methods, featuring cutting edge robotic technologies. Through the use of advanced in-process sensing systems, 6DE-4 is capable of automatically adjusting its operating parameters based on the material properties of the wafer in order to ensure optimal polishing performance. Additionally, STRASBAUGH 6DE-4 integrates multi-head load/unload systems so that operations can occur while the wafers are being fed to and from the unit. 6DE-4 also offers advanced process monitoring and control capabilities. The device supports closed-loop operation, which ensures the highest degree of process accuracy. Additionally, the machine supports a wide range of software and hardware-based monitoring functions, allowing for real-time data-driven process control. To ensure a safe and clean working environment, STRASBAUGH 6DE-4 holds all dust and debris generated by the wafer grinding, lapping and polishing processes in all adjacent wells. This keeps the wafer surfaces free of contamination and reduces the risk of airborne particles. Overall, 6DE-4 is an advanced wafer grinding, lapping and polishing tool that far exceeds the performance requirements of today's ever-evolving semiconductor industry. It provides the highest possible levels of safety, accuracy, repeatability and throughput for each operation.