Used STRASBAUGH 6DE-DC-1 #293807565 for sale

ID: 293807565
Polishers DC Drive Platten, 6" (2) 1/2 HP Motors Spindle load: 1720 lbs Spindle torque: 150 lbs Eccentric motion, 8" Oscillating arm, 3" Oscillating speed: 10 to 200 RPM Digital timer for polishing cycles, 150 RPM Power supply: 220 V, Single phase, 50/60 Hz.
STRASBAUGH 6DE-DC-1 is an advanced, fully-automated wafer grinding, lapping & polishing equipment designed to achieve high-precision and superior surface quality on all types of semiconductor materials. STRASBAUGH 6DE-DC1 system is engineered with a 6" circular platform that can accommodate any type of material from extremely thin (<100 microns) to thicker wafers up to 1.5mm in thickness. It includes an industrial-grade stepper motor that ensures precise and repeatable movement of the grinding arm. A removable lapping plate also comes integrated with the unit, allowing for quick and easy polishing/lapping of ultra-thin wafers. 6DE-DC-1 is powered by a high-performance direct-drive motor for superior speeds and reliable accuracy. Additionally, a digital vacuum control feature helps to prevent sample adhesion, while a cooling fan ensures accurate temperature control for consistent results. 6DE-DC1 also includes a wide variety of customizable operations and control parameters, allowing for unique processing needs. This includes an auto-stop feature that can be adjusted to control the polishing time and pressure settings. The machine also features a patented surface metrology calibration tool as well as an advanced PLC tool to provide accurate real-time feedback and reporting of the process. In terms of safety, STRASBAUGH 6DE-DC-1 is outfitted with a variety of safeguards, including shielding to protect operators from potential hazards, and a motion sensor for instant asset shutdown in case of danger. It also includes an air filter that captures and removes potentially hazardous particles. STRASBAUGH 6DE-DC1 wafer grinding, lapping & polishing model is an innovative and reliable tool for processing all types of semiconductor materials. Its robust design and high-precision features allow for fast and precise processing of wafers up to 1.5 mm in thickness, ensuring superior surface quality and repeatable performance each time. With its suite of integrated safety precautions, 6DE-DC-1 equipment is the perfect tool for mastering your wafer processing requirements.
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