Used STRASBAUGH 6DF-DC-2 #293654296 for sale

STRASBAUGH 6DF-DC-2 is a powerful and precise wafer grinding, lapping and polishing equipment for use in the semiconductor industry. The machine is designed to handle a wide range of materials and process sizes, allowing manufacturers to achieve high yields in the production of their products. The system incorporates a three-headed rotary table design, which allows up to three wafer processing operations to be carried out simultaneously. Each head is driven by a powerful servo motor and offers a variable speed range of 0-300 RPM. The axes of the device are driven by a combination of linear and rotary motors, enabling very precise and highly repeatable positioning. The integrated robotic mechanism allows the unit to automatically load, unload and position a variety of wafer sizes. 6DF-DC-2 comes equipped with a variety of process heads. These include diamond grinding heads to reduce wafer size, structure heads to create surface features, lapping heads to provide a flat and uniform surface, and polishing heads for a clean, flawless finish. A range of polishing pads and diamond grinders allow for maximum material removal or polishing capability. The machine features a range of environmental controls, including dust collection, high and low temperature control, and flow control. It is capable of achieving excellent accuracy and repeatability of processes when specified process parameters are maintained. It also comes with a range of safety and security features, including safety light curtains and vibration detection. The overall design of STRASBAUGH 6DF-DC-2 makes it an ideal choice for many semiconductor applications. Its combination of precise and repeatable processes, wide material range, customizable controls and robust safety measures make it an ideal tool for meeting the demands of the semiconductor industry.