Used STRASBAUGH 6DS-SP #293592627 for sale

STRASBAUGH 6DS-SP is a versatile wafer grinding, lapping and polishing equipment, designed for maximum accuracy and throughput. The system features an integrated spindle with variable speed settings for precise control over surface finish, with a range of options including wet grinding, dry polishing, and the ability to process multiple wafers at the same time. STRASBAUGH 6 DS-SP is equipped with two polishing heads, both of which can be individually adjusted for height and distance from the wafer. The unit also features an auto focus feature which ensures a perfect focus every time. The machine is capable of handling a variety of materials including silicon, optically sensitive and high temperature oxidation materials. The spindle speed is easily adjustable and the tool includes a PLC controller, which can be programmed to adjust the process parameters during the grinding, lapping and polishing stages. The asset is capable of processing wafers up to 200mm in diameter and the process can be programmed to occur in single or multiple stages. 6DS-SP is a highly accurate, high-precision machine, capable of reproducing surface finishes of 0.2-2 μm Ra, with excellent yield performance. The model is designed for 24/7 continuous operation and has a robust, variable speed spindle motor that can process wafers up to 10,000 RPM. The equipment also features a fail-safe safety system that provides a warning before a potential hazard occurs and proceeds to shut down the unit upon detection. Common applications of 6 DS-SP include solar cell manufacturing, optical coating processing and hard disk head and read/write head polishing. STRASBAUGH 6DS-SP is an excellent choice for precision wafer grinding, lapping and polishing, offering reliable functionality and a range of programmable features to ensure accurate production of wafers, regardless of the material type. The machine is suitable for use in laboratories and production environments and offers excellent repeatability and consistency, as well as excellent speed, combining optimum processing performance with high throughput yield.