Used STRASBAUGH 6DS-SP #293594671 for sale

STRASBAUGH 6DS-SP is best-in-class wafer grinding, lapping and polishing equipment designed for high precision and throughput. The system is built to provide maximum throughput and precision offering grinding, lapping and polishing of up to 400 mm silicon, III-V and compound semiconductor wafers with up to 20 micron surface finish. The unit can perform single or multiple operations of grinding, lapping and polishing, both relative roughing and finishing operations. It features three-axis motion control and wafer load/unload tables with automatic and manual operation modes, as well as self-contained robotic sorting of parts. The machine is suitable for a wide variety of operations—from grinding and lapping to polishing and back grinding, both precision and high-throughput processes. It can also be used for wafer slicing, wire sawing, through-hole drilling and high-speed dicing. It utilizes a three-axis high-performance vertical machine axis with multi-axis compensation for accuracy and repeatability. Its individual feed speeds and directions, along with its modular adjustment parameters, makes it suitable for all process steps. The precision linear slides, driven by direct stepper motors, are used for all three axes to improve accuracy and surface finish. The tool also employs digital control with CANbus-controlled components and Ethernet connectivity for remote integration. Its high-precision air bearings are designed for low vibration and superior 'stick-slip' characteristics, designed for extreme accuracy and for ultra-low wafer deflection. The highly automated asset uses semi-automatic load/unload systems to lower cycle times and eliminate the possibility of human error. The model also includes a graphical tool path editor, which allows the user to quickly and easily create a large variety of complex shapes, curves, lines and tapered features. Additionally, its closed-loop control is designed to automatically adjust the grinding cycle to each of the process conditions to maintain the highest possible accuracy and surface finish. STRASBAUGH 6 DS-SP is capable of serving a variety of industries, from aerospace and automotive to consumer electronics, offering a cost-effective, reliable and efficient solution to wafer grinding, lapping and polishing. In addition to being user-friendly and offering excellent accuracy, repeatability, and speed, the equipment offers a quicker return on investments and maximum throughput.