Used STRASBAUGH 6DS-SP #293594673 for sale

STRASBAUGH 6DS-SP is an advanced wafer grinding, lapping and polishing equipment used in the semiconductor industry. It is capable of producing high-precision dielectric and metal-based wafers with excellent surface quality. The system utilizes a precision abrasive wheel and belt to reduce surface roughness, improve material removal rates, and create very smooth surfaces. Wafer grinding is done using diamond-coated abrasive wheel and belt. This combination provides superior long-term abrasive performance and flexibility, enabling more efficient and consistent grinding. A controlled lapping process is used to further improve the surface characterization and prepare the wafer for polishing. This ensures homogenous lapping and polishing across the entire wafer surface. STRASBAUGH 6 DS-SP wafer grinding unit is equipped with advanced automation and programmed recipe control, allowing it to be operated with minimum user intervention. Its control software is designed to provide an easy to use, intuitive and powerful interface. A precision vision machine is used to inspect each wafer's surface and to monitor setup parameters, material removal rates and uniformity of lapping and polishing. This ensures high-quality wafer output, regardless of the batch size. 6DS-SP is based on the proven STRASBAUGH 6DFTM platform and is compatible with the latest semiconductor-grade metals, alloys and dielectric materials. It features advanced material handling capabilities and provides maximum reliability for repeatable and reproducible results. The tool is specifically designed to handle high volume production runs of 1 to 30-inch wafers with thin layers of metal materials and dielectric substrates. 6 DS-SP also offers high precision automated wafer process control and environmental containment, allowing full control over the quality of results. It offers a wide range of advanced controls, such as process parameter optimization and wafer history tracking, which help to reduce risk and eliminate processing errors. The asset is designed with quality assurance in mind and incorporates key quality control tools such as stress mapping, statistical process control and failure analysis. When used in conjunction with the 6DFTM, STRASBAUGH 6DS-SP is a formidable model for precision wafer processing. It is capable of meeting the demanding life-cycle requirements of high-reliability wafer products, making it ideal for process development and production runs.