Used STRASBAUGH 6DS-SP #293594676 for sale

STRASBAUGH 6DS-SP is a precision grade wafer grinding, lapping, and polishing equipment designed to meet the highest levels of surface finish and shape accuracy in the production of compound semiconductor device wafers. The system is the result of advanced engineering and is well suited to applications requiring a high degree of precision and repeatability. The main components of the unit include a grinder, a lapping manifold, a polishing carrier, an environmental control machine (ECS) and a control console. The grinder is equipped with a 6" carbide grinding wheel capable of coarse and fine grinding with excellent surface integrity. The precision grinder carriage, the core of the tool, uses linear bearing technology and can be programmed for a high level of performance. The lapping manifold is designed to provide a consistent uniform lapping environment with a precisely controlled and optimized solution, complete with manual adjustments to accommodate a wide range of customized requirements. The precision polishing carrier, equipped with diamond abrasive pads, is designed to achieve superior surface finish and uniformity. The ECS is designed to reduce dust, minimize one-step grinding on a single wafer, and eliminate the risk of surface damage. The ECS utilizes a three-stage filtration asset to capture and remove debris, ensuring a clean and repeatable surface finish. STRASBAUGH 6 DS-SP control console includes a microprocessor-controlled graphical user interface (GUI) that provides an intuitive and user-friendly way to interact with the model. The GUI enables the user to configure, run and store programs, adjust parameters, and store data. In addition, the equipment includes a wafer handling unit with vacuum wafer chucks and a removable wafer cassette to facilitate automatic jogging and loading of wafers into the system. 6DS-SP is a powerful and reliable unit backed by extensive research and development. This machine has been designed and engineered to meet the demanding requirements of the semiconductor industry. With its advanced technologies, 6 DS-SP is capable of processing wafers with superior surface integrity and high throughput.