Used STRASBAUGH 6DS-SP #293594677 for sale

STRASBAUGH 6DS-SP is a state-of-the-art wafer grinding, lapping, and polishing equipment. STRASBAUGH 6 DS-SP is capable of grinding and lapping wafers up to 8-inch (200 mm) in diameter with process times as fast as 1 minute. It is designed to handle a variety of wafer substrates including Silicon, Quartz, Gallium Arsenide, Indium Phosphide, and Sapphire. 6DS-SP can process single or multi-wafer substrates and has the ability to grind, lapping, and polishing both sides of a substrate. 6 DS-SP is designed to provide a fast, efficient, and cost-effective solution for a range of wafer processing applications. This system features a servo driven spindle for precise and repeatable wafer grinding and lapping processes. It also incorporates a microprocessor controlled wafer transfer unit for automating the wafer handling and loading of individual wafers. STRASBAUGH 6DS-SP utilizes a combination of air bearing, vacuum and gravity clamps to securely hold and control the wafers during processing. STRASBAUGH 6 DS-SP is outfitted with an embedded Windows-based computer machine providing a fully integrated and user friendly interface. This enables the operator to easily control all necessary process parameters, and to store and retrieve processing recipes for specific wafers. 6DS-SP also includes a number of advanced wafer processing features including waterjet cleaning, three motion lap plate operation, and an advanced monitoring tool for precision wafer grinding. For superior wafer grinding and lapping process results, 6 DS-SP is an optimal choice. Its closed-loop control asset and advanced monitoring capabilities ensure precise, repeatable results. The embedded operating model easily allows operators to store and retrieve recipes for multiple substrates and process conditions. The fast equipment processing speeds and flexible wafer handling options make STRASBAUGH 6DS-SP a reliable and efficient wafer processing solution for any production environment.