Used STRASBAUGH 6DS-SP #293594678 for sale

STRASBAUGH 6DS-SP wafer grinding, lapping & polishing equipment is a specialized system for use in the semiconductor wafer fabrication process. The unit consists of a set of precision-machined components, including a housing, a grinding wheel, and a polishing table. The machine is used to create perfectly smooth and even surfaces on silicon wafers, allowing for improved device performance and increased production yields. The grinding wheel in the tool is used to mechanically reduce the size of the wafer. This process removes large surface defects and produces a moderately fine-grained surface structure. The lapping process then uses a rotary lapping table to further refine the surface of the wafer. A polishing table then smooths any remaining imperfections on the wafer. STRASBAUGH 6 DS-SP is designed for excellent control of surface finish parameters, with proprietary algorithms and a combination of grinding and polishing techniques that are intended to ensure great repeatability and high yields. The asset is capable of producing surfaces with RA (roughness average) values below 0.2 nm and WLP (wavelength laser profilometry) values below 0.3nm, with a smoothness up to 0.03nm RMS. 6DS-SP model is extremely robust, with a power rating of 480V, 3-phase, 50Hz, and an operating temperature range from -20 to 70 degrees Celsius. The equipment also features a variety of safety features, including an over-temperature shutdown, a programmable emergency stop system, and a grounding switch. In addition to its excellent repeatability, the unit is also extremely fast, able to reduce wafer thicknesses from 500 μm to less than 100 μm in less than 50 seconds, with production rates of up to 50 wafers/minute. The machine also requires minimal operator intervention, and is virtually maintenance free, reducing costs and improving efficiency. The tool is also highly reliable, with a mean time between failure rate of more than 250,000 hours. Finally, 6 DS-SP is a highly modular asset, capable of being customized to specific manufacturing needs. Additionally, the model is highly flexible, capable of accommodating wafers of any material and any thickness, as well as different grinding and polishing parameters. STRASBAUGH 6DS-SP wafer grinding, lapping & polishing equipment is an excellent choice for precision wafer fabrication operations looking to optimize productivity and yield. Its combination of precision, speed and flexibility makes it an ideal solution for high-volume semiconductor manufacturing operations.