Used STRASBAUGH 6DS-SP #293646044 for sale

STRASBAUGH 6DS-SP is an advanced and highly advanced wafer grinding, lapping & polishing equipment. This system allows for precision grinding, lapping, and polishing of delicate materials such as semiconductor, sapphire, and quartz wafers. This unit is suitable for use in harsh and hazardous environments, making it a suitable choice for high-volume semiconductor fabrication. STRASBAUGH 6 DS-SP machine combines a series of advanced technologies that allow for the precise and accurate shaping of wafers as thin as 0.1mm. The tool features a programmable rotating head, which allows for precise grinding, lapping, and polishing of the surface of the wafer. The asset also utilizes a pressure monitoring model, which allows for the precise regulation of pressure during the grinding, lapping, and polishing process. In addition, an integrated wafer loader motor helps to ensure consistent loading and unloading of the wafers. The equipment also employs advanced abrasive technology. This technology utilizes abrasive particles of aluminum oxide and diamond to create a controlled grinding, lapping, and polishing of the wafer. This technology allows for a more consistent surface finishing, resulting in reduced defects and improved product yields. 6DS-SP system also features a programmable control unit, which allows for easy control of the grinding, lapping, and polishing process. This control machine can be programmed to perform a number of functions, such as adjusting the grinding speed, pressure, and abrasive type. The control tool also includes a range of options for monitoring and data logging of the process, allowing for precise and consistent execution of the process. In conclusion, 6 DS-SP asset is an advanced and highly advanced wafer grinding, lapping & polishing model that is suitable for use in high volume semiconductor fabrication. This equipment combines a series of advanced technologies that allow for precise and accurate shaping of wafers as thin as 0.1mm, while utilizing a programmable control system for easy control and precise regulation of the grinding, lapping, and polishing process.