Used STRASBAUGH 6DS-SP #293709492 for sale

STRASBAUGH 6DS-SP is a wafer grinding, lapping, and polishing equipment intended for a variety of materials, such as Yttrium Oxides, SiC, GaN, and Si-based compounds. It's designed for processing higher-precision wafers with improved surface finishes, allowing for more efficient and effective lapping and polishing processes. The system works by taking a wafer input and placing it on a loading station. The operator then selects the desired grinding, lapping, and polishing processes to be carried out. The wafer is then conveyed to the grinding section, where it is grinded by abrasive particles that are suspended in a fluid located inside the grinding chamber. This process removes material from the wafer's surface, allowing for polishing operations to take place. The wafer is then conveyed to the lapping section, where it is lapped using abrasive materials and special lapping fluids. This process smoothes and polishes the surface of the wafer to produce a more uniform surface finish. Finally, the wafer is placed into the polishing station and is subjected to four primary polishing techniques. First, the wafer is surface conditioned, which removes scratches and imperfections in the surface of the wafer. Second, the wafer is subjected to a chemical-mechanical polishing process, which the use of chemical abrasives help to further smooth and refine the surface. Third, the wafer is subjected to an electro-polishing process, which further refines the surface of the wafer. Lastly, the wafer is subjected to a sub-micron polishing process, which is designed to produce a surface finish that has an even smaller grain size than that of the previous process. Ultimately, STRASBAUGH 6 DS-SP unit is a high-precision wafer grinding, lapping, and polishing machine that helps to produce wafers with improved surface finishes and greatly reduce the amount of material needed to be removed during processing.