Used STRASBAUGH 6DS-SP #293747127 for sale

STRASBAUGH 6DS-SP is a next-generation wafer grinding, lapping, and polishing equipment that is designed to provide the most reliable and efficient processing of semiconductor substrates. The system is engineered with advanced technologies to deliver superior performance in all stages of backside thinning, grinding, lapping and polishing. STRASBAUGH 6 DS-SP unit uses a variable speed motor to deliver high repeatability and a controlled process. It features a PLC control machine to ensure that the desired machine settings and process parameters are maintained throughout the process. The tool can accommodate wafers between 200mm and 300mm in diameter. Its conveyor belt design provides rigidity and accuracy, as well as a low-profile footprint for space-constrained environments. 6DS-SP features an integrated cross-link conveyor asset that ensures optimized substrate loading and wafer management, offering high throughput. Its process chamber has a full-view, pass-through design that provides easy accessibility when it's time for cleaning and other maintenance tasks. The model also equips a dressing table located outside the process chamber. This allows the operator to conveniently dress grinding wheels prior to the grinding process. The hybrid grinding equipment uses both rotary and planetary motions to create oscillatory paths to achieve a higher grinding efficiency and uniformity. A high-efficiency filtration system eliminates airborne particles, protecting the wafer surface during the process. In addition, 6 DS-SP systems comes with a comprehensive set of setup and monitoring tools. The software suite includes high-level process control, data logging, online diagnostics and reporting in data format. Real-time process control is possible with the unit's universal process parameters database, allowing adjustments based on application requirements. The machine also includes a 3D laser surface map for uniformity measurement. STRASBAUGH 6DS-SP wafer grinding, lapping, and polishing tool utilizes proven technologies to deliver reliable and repeatable results in semiconductor material processing. Offering fast and efficient substrate loading and wafer management, powerful motor acceleration and controlled process parameters, making it the ideal solution for high-speed processing requirements.