Used STRASBAUGH 6DS-SP #293754576 for sale

STRASBAUGH 6DS-SP is a revolutionary wafer grinding, lapping and polishing equipment designed to meet the rigorous demands of today's thin wafer processing industries, providing both precision and high production throughput. This system combines high speed, low noise and top surface finish with low contamination and minimal cycle time. STRASBAUGH 6 DS-SP's central component is its 6-axis, computer controlled grinding head that utilizes patented 'Gator' tooling for an unparalleled grinding and polishing experience. Multiple high-speed grinding and polishing heads are capable of meeting the needs of the most demanding process requirements. The protective cover minimizes airborne contamination and the enclosed chamber creates a clean, mildew and particle-free environment. 6DS-SP accommodates substrates from 200mm to 300mm in diameter, making it suitable for a variety of thin wafer processing tasks. The unit can handle an impressive range of substrates, from rigid substrates such as silicon wafers to soft substrate applications such as glass, ceramic, and aluminum. The integrated measurement machine, online particle size measurement, and flex-pulse technology guarantee maximum substrate performance and a repeatable, consistent polishing result. To guarantee accuracy, 6 DS-SP is equipped with a high resolution microscope and accompanying vision camera. The microscope, with up to 30x magnification, inspects the polished surface from any angle with high precision. The vision camera captures and records high-definition images of the substrate surface quickly and accurately in order to ensure constant performance. The full-featured touch screen equipped with PC control is fast and intuitive for set-up and programming. STRASBAUGH 6DS-SP is equipped with state-of-the-art automation technology and integrated advanced process computer and data logging capabilities, which provide a detailed view of wafer processing performance and help track process trends. STRASBAUGH 6 DS-SP also offers a wide range of safety features, including automatic overload protection and a process interrupt tool that reacts instantly to unsafe conditions. By completing lapping and polishing tasks in half the time of traditional methods, 6DS-SP is the go-to choice for those looking to obtain superior surface finish with minimum cycle time. With its superior feature set and user friendly design, 6 DS-SP is the ideal choice for all thin wafer processing needs.