Used STRASBAUGH 6DS-SP #293811509 for sale

STRASBAUGH 6DS-SP Wafer Grinding, Lapping & Polishing Equipment is a multi-function advanced processing unit designed for the precision and efficient production processing of the most delicate optoelectronic and semiconductor components. This highly integrated system has the capability to achieve ultra-precise planar or 3-D surface finishes on wafers quickly, consistently and with high yields. STRASBAUGH 6 DS-SP features a highly efficient six-axis robotic tool changer with a variety of interchangeable grinding and lapping tools, a vacuum-controlled semiconductor loader and wafer handling unit, and a triple-level, automated polishing control scheme with software-controlled polishing heads. This comprehensive machine allows for the highest level of automation, repeatability and yield. 6DS-SP utilizes its propriety 6-axis MultiRobot tool changer technology to automatically change out its grinding and polishing tools providing the fastest tool change times available on the market. This allows for the rapid processing of large volumes of work pieces with minimal operator assistance. The combination of a TwinReader InfraRed Sensing tool with a custom Robotic Handler Arm maximizes repeatability and accuracy. The automated semiconductor loader and wafer handling asset provides for the specialized loading and unloading of wafers with speeds up to 4,000 wafers per hour. This highly efficient loading and unloading model helps reduce cycle times and increase production yields. Furthermore, the precision adjustable vacuum equipment provides a secure, uniform grip on the wafer without damaging its sensitive surface. The innovative 6-axis Robotic Tool Maintenance function ensures that any tools not working correctly are automatically detected and replaced. This feature helps minimize process time delays due to tool failure and keeps production running smoothly. 6 DS-SP is capable of handling up to 8-inch wafers with a thickness of up to 25mm. This highly integrated, automated system precisely adjusts surface finishes to meet customer specifications while providing the ultimate in repeatability and yields. The unit is well suited for the stringent demands of the optoelectronic and semiconductor industries and can effectively meet the highest requirements in today's dynamic marketplace.