Used STRASBAUGH 6DS-SP #293813077 for sale

STRASBAUGH 6DS-SP is an advanced wafer grinding, lapping and polishing equipment that provides the highest levels of accuracy for planarization and surface roughness, and is particularly well-suited for high-volume production applications. The system uses a combination of abrasive grits, slurries and specialty gases to achieve ultra-precise, surface flatness and low surface roughness results on semiconductor wafers, MEMS components and other delicate products. At the heart of the unit lies a 6-directional spindle (6DS) design, featuring six, independent axes of motion which can simultaneously grind and lap small, delicate parts. This provides streamlined, multi-operation process capability with excellent surface finish levels. Additionally, the machine simultaneously processes multiple planarization and surface finishing operations in one cycle, with excellent repeatability and responsiveness to customer requirements. STRASBAUGH 6 DS-SP includes a spectrum of process capabilities from wafer grinding and slicing in one operation, to surface passivation and finishing, with lapping and polishing operations in a single cycle. Additionally, the tool facilitates simultaneous trimming, grinding, and backside grinding when handling wafers and singulated die. 6DS-SP also features a "Hot Process Mode", allowing the asset to quickly and accurately respond to fast-cycle, customer-specified parameters without the need for intermediate setup and validation. The model also features advanced optics and vision technology, allowing it to use infrared light sources and a 3D digital camera to automatically detect any surface misorientation then instantly adjust motions to remove the discrepancy. 6 DS-SP also offers an optional tilted spindle, which allows micro-mechanical components to be processed in the same operation as wafers. Overall, STRASBAUGH 6DS-SP offers unprecedented levels of accuracy for simultaneous grinding and lapping and polishing operations, with the flexibility to quickly and efficiently meet customer-defined parametric requirements. This makes it ideal for high-volume production operations where high-precision, low surface roughness, and flatness results are required.