Used STRASBAUGH 6DS-SP #293821519 for sale

ID: 293821519
Wafer Size: 6"
Vintage: 2007
CMP Polisher, 6" Dimensions: 4" x 6" x 8" ENTEGRIS wafer carrier PA194‑60MB‑61C02 Dual‑lot processing capability with four internal cassettes (2 sender, 2 receiver) 2007 vintage.
STRASBAUGH 6DS-SP is a full-featured, single-platen, multi-head wafer grinding, lapping and polishing equipment designed to provide a uniform and highly controlled surface finish on a range of wafer substrates. This system provides automated grinding, lapping, and polishing on both sides of the wafer, in a single-platen, multi-head configuration to ensure excellent surface uniformity. STRASBAUGH 6 DS-SP unit utilizes advanced polishing and grinding technologies, such as infinity axis, mono-ring, single-side, and sequentially machined bell technologies, to achieve consistent and accurate surface effects. The integrated in-situ metrology machine retrospectively monitors the grinding and polishing process to ensure the desired surface finish on each wafer. 6DS-SP utilizes sophisticated robotic handling mechanisms for both heads to ensure precise positioning of each head to the wafer surface. The tool is also capable of locating defects in the wafer to prevent further irregularity in the polishing process. 6 DS-SP is also designed for flexibility. It utilizes a vibration isolation table to minimize microvibrations and to maintain asset accuracy during operation. It is also designed to handle a wide variety of wafer sizes, shapes and configurations. Additionally, STRASBAUGH 6DS-SP model comes with an on-board wafer inspection equipment, offering the ability to quickly identify and isolate defects and irregularities. Additionally, the system includes a built in data acquisition and control unit, providing users with the ability to monitor and track the entire production process. STRASBAUGH 6 DS-SP is powered by a comprehensive and reliable distributed machinery control machine, offering a user-friendly interface to quickly view tool conditions, metrics and data. Its suite of advanced configuration options also makes it versatile and customizable, allowing users to tailor their machine to best suit their applications. Overall, 6DS-SP is an advanced and reliable asset for grinding, lapping and polishing wafers. Its automated control model, and suite of features, provide users with an easy and dependable way to achieve perfectly uniform and accurate surface finishes. 6 DS-SP is an invaluable tool for any organization looking to streamline their production process and bring quality assurance to their operations.
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