Used STRASBAUGH 6DS-SP #293824915 for sale

The Strausbaugh STRASBAUGH 6DS-SP is a powerful and versatile wafer grinding, lapping and polishing equipment designed for the semiconductor industry. It is a high speed, fully automated system designed to produce high precision surfaces for a variety of wafer forms and sizes. This unit offers a wide range of application possibilities ranging from grind, lapping and polishing for various wafer substrates, such as polycrystalline silicon, gallium arsenide and more. STRASBAUGH 6 DS-SP is an especially effective and efficient machine for thinning thin wafers. This tool utilizes a high speed, multi-faced spindle equipped with diamond wheels that simultaneously grind, lapped or polished on all sides of the substrate. This spindle is vertically mounted on a high rigidity, low heat expansion frame to minimize run-out and maintain accuracy during process cycles. The spindle is controlled by a servo motor with a precision encoder providing dynamic speed control and feedback to ensure the grinding and polishing processes are consistent and repeatable. In addition, this asset features a closed loop process control that primarily allows users to specify the parameters of the process and provides a feedback to the controller to make sure that the process parameters are being followed and that the desired surface finish is being achieved. The proximity sensors on the spindle monitor the load forces, which are then compensated for by the controller. This assists in producing compatible and repeatable surface finish results. The Strausbaugh 6DS-SP also contains a variety of built-in safety features, such as enclosure interlock protection and abrasive contamination prevention. In addition, this model is designed to minimize thermal expansion and minimize processing time through the use of optimized, high-precision spindle using high-precision and high-efficiency diamond wheels. This equipment is compatible with a variety of grinding, lapping, and polishing systems, such as laser processing, conventional grinding, thinning, and polishing systems. Additionally, it is able to handle wafers of thickness ranging from 150μm - 6μm with a 100mm max outside diameter. The Strausbaugh 6 DS-SP has been designed to maximize productivity while maintaining precision, repeatability and accuracy.