Used STRASBAUGH 6DS-SP #293831063 for sale

STRASBAUGH 6DS-SP is a next-generation wafer grinding, lapping and polishing equipment used for high-precision planarization and finishing of semiconductor wafers. This system is utilized for mechanically and chemically polishing planar surfaces to optical quality specifications with low overall surface topography. STRASBAUGH 6 DS-SP unit is designed to deliver superior performance with peak-to-valley roughnesses as low as 0.08nm and ultra-smooth surface finish on a range of exotic materials such as SiC, GaN and GaAs. 6DS-SP is a multi-axis platform featuring an overhead handling machine and an eight-spindle lapping head. This is combined with a three-zone 'Load Lock' design and a double-deck grinding head with integrated recirculating coolant tool. Each lapping head spindle is built with a unique clamping mechanism to ensure that the wafers are accurately held during process. An integral isolator cabinet is incorporated in the design to reduce asset acoustic noise as well as airborne and electrical noise. The control model for 6 DS-SP uses a color touchscreen and a man-machine interface for operator convenience. Process optimization is achieved by the real-time data acquisition equipment, which tracks surface topographies, vacuum levels and clamping forces. In addition, a SmartMove tool path optimizer is used to optimize the lapping, grinding and polishing process. STRASBAUGH 6DS-SP is capable of producing highly precise and repeatable results through an in-process metrology option. This is used to measure the current surface profile, ensuring that the correct process parameters are applied and allows for a control loop where topography is improved with each cycle. Further, the low lint environment promoted by STRASBAUGH 6 DS-SP minimizes particle contamination and thus increases the final reliability of the product. 6DS-SP wafer grinding, lapping and polishing system is a robust and reliable platform that ensures consistent processing on a wide range of materials. This unit enables the manufacturing of high quality semiconductors and other components within tight tolerances, driving productivity and cost-efficiency. Its innovative design, high accuracy and advanced functionalities combine to meet the toughest process requirements.