Used STRASBAUGH 6DS-SP #293831632 for sale

STRASBAUGH 6DS-SP is an innovative tool for higher accuracy wafer grinding, lapping, and polishing. The equipment, which is suitable for 6" and 8" wafers, combines the newest technologies of CMP (Chemical Mechanical Planarization), Optical Polishing, and High-Intensity Grinding (HIG) processes to allow uniform and repeatable removal of topography across both wafer surfaces regardless of their feature locations. The unique triple pass system utilizes CMP and polishing processes to remove material from the wafer's surface and HIG to simultaneously shape and planarize the wafer. The unit's ease of integration into an existing manufacturing process lowers cost, minimizes space requirements, and simplifies training. STRASBAUGH 6 DS-SP's CMP process is based on an adjustable pressure zone that reduces force on the topography, improving the accuracy of material removal. Additionally, the machine uses rotary media and polyurethane abrasives that are configured in a dual-axis oscillation mode to improve productivity. The mathematically generated arcs of the polyurethane abrasives help form a continuous, highly repeatable finish. The precision polishing process of 6DS-SP also contributes to high accuracy and repeatability. A pre-load unit applies a uniform force against the wafer surface allowing better control of the polishing effectiveness, while a retainer assembly ensures no contamination of the wafer. In addition, the tool includes both an adjustable speed and variable heat control, which give more control over the polishing process. The final component of 6 DS-SP asset is the high-intensity grinding process which helps to achieve high accuracy and repeatability. This process utilizes diamond plated grinding wheels in combinations of 25-30,000 RPMs to grind away any remaining topography in microns. STRASBAUGH 6DS-SP is ideal for manufacturing applications and research projects requiring accuracy and repeatability of wafer grinding and polishing and offers a smaller footprint and lower cost of ownership without sacrificing performance. By integrating the newest technologies of CMP, polishing, and high-intensity grinding processes into a single, compact model, it delivers improved wafer surfaces with unsurpassed repeatability for greater yields and higher profits.