Used STRASBAUGH 6DS-SP #293831748 for sale

STRASBAUGH 6DS-SP is an advanced wafer grinding, lapping and polishing equipment designed to produce high precision wafer surfaces. It is equipped with a range of features that provide an effective and efficient solution for a wide variety of wafer surface applications. The system is equipped with two 3-axis mounting stages, enabling high accuracy wafer surface grinding, lapping and polishing. STRASBAUGH 6 DS-SP also uses two X-Y-Z motions to accommodate a maximum wafer size of 6-inch with a maximum thickness of 5.7mm. The unit has an advanced motion programming feature which allows users to easily design grinding, lapping and polishing paths. 6DS-SP also offers a sophisticated grind, lap, and polish smart profile technology which allows users to easily set up, load and configure jobs. The machine also has a transport tool for air-bearing spindle transport and tool change for lapping and polishing processes and it is also equipped with integrated rotary indexers for high-resolution wafer loading. 6 DS-SP utilizes a closed-loop process that maintains and controls pressure, speed and oscillation of the wafer throughout the entire process, ensuring consistent and accurate results. The asset is also equipped with a reliable and maintenance-free, fully integrated drive model and drive accuracy. This ensures high surface finish accuracy and repeatability. STRASBAUGH 6DS-SP is also equipped with a highly efficient gas-bearing spindle, which is optimized to ensure optimal running performance, achieving vibration suppression and reduced thermal noise. The equipment also has a coolant system and improved leakage prevention which helps to prevent any potential contamination of the wafer surfaces. Overall, STRASBAUGH 6 DS-SP wafer grinding, lapping and polishing unit is an advanced and highly effective tool for achieving precision wafer surfaces. With its range of features, it offers an efficient and reliable solution for a variety of wafer surface applications.